Samsung might not have their Exynos SoC in the majority of smartphones today, but they build the ones that a lot of people are using. For example, since the last two years, Qualcomm has hired Samsung to fabricate their high-end Snapdragon chips after being partnered with TSMC for so long. Thanks to these partnerships, Samsung has been able to grow its foundry business and today, they have strengthened their portfolio with the announcement of a new 11nm process technology.
When comparing this new process to their older earlier 14nm LPP process, the 11nm LPP delivers up to 15% more performance while also reducing the chip area by 10%. This doesn’t bring a reduction in power consumption though, and is simply about increasing performance while also reducing the chip area. We’re currently used to Samsung’s 10nm FinFET process in SoCs such as the Snapdragon 835, but the company is positioning this new 11nm LPP process as a way to bring differentiated value to mid to high-end smartphones.
This new technology is currently scheduled for production for the first half of 2018. Along with this new announcement today, the company has also confirmed that the development of their 7nm LPP process is still on schedule and has not faced any delays. This product will be using EUV (extreme ultra violet) lithography technology and is said to be on track for its initial production in the second half of 2018.
The company has been working on this EUV lithographic technology since 2014 and since then they’ve been able to produce close to 200,000 wafers. Previously, this was shown to result in low yield but as they learnt more about it, Samsung has been able to apply new methods which has increased their yield up to 80% for their 256 megabit (Mb) SRAM (static random-access memory) units. For those wanting to learn more about Samsung’s foundry roadmap, you can look forward to Samsung Foundry Forum Japan on September 15, 2017, in Tokyo for more details.
Source: Samsung Newsroom
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